Metallurgical factors behind the reliability of high density lead-free interconnections

Toni Mattila, Tomi Laurila, Jorma Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

    Original languageEnglish
    Title of host publicationMicro-and Optoelectronic Materials and Structures; Physics, Mechanics, Design, Reliability, Packaging
    Place of PublicationNew York
    Publication statusPublished - 2007
    MoE publication typeA3 Part of a book or another research book

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