Metallurgical factors behind the reliability of high density lead-free interconnections

Toni Mattila, Tomi Laurila, Jorma Kivilahti

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Scientific › peer-review

Original language	English
Title of host publication	Micro-and Optoelectronic Materials and Structures; Physics, Mechanics, Design, Reliability, Packaging
Place of Publication	New York
Pages	313-350
Publication status	Published - 2007
MoE publication type	A3 Part of a book or another research book

OpenUrl availability

@inbook{1f8b2a006d214e8f920728077853660b,

title = "Metallurgical factors behind the reliability of high density lead-free interconnections",

author = "Toni Mattila and Tomi Laurila and Jorma Kivilahti",

year = "2007",

language = "English",

pages = "313--350",

booktitle = "Micro-and Optoelectronic Materials and Structures; Physics, Mechanics, Design, Reliability, Packaging",

}

Micro-and Optoelectronic Materials and Structures; Physics, Mechanics, Design, Reliability, Packaging. New York, 2007. p. 313-350.

Research output: Chapter in Book/Report/Conference proceeding › Chapter › Scientific › peer-review