Mechatronic Swarm and its Virtual Commissioning

Tuojian Lyu*, Andrei Lashchev, Sandeep Patil, Udayanto Dwi Atmojo, Valeriy Vyatkin

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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This paper presents a swarm-based architecture for the composition of mechatronic systems from smart components complemented by a Virtual Commissioning (VC) environment. The architecture is based on the IEC 61499 standard. The proposed solution enables plug-and-play composition of the system which is ready to operate 'out of the box' right after it was composed without extra programming.

Original languageEnglish
Title of host publicationProceedings - 2023 IEEE International Conference on Mechatronics, ICM 2023
Number of pages6
ISBN (Electronic)978-1-6654-6661-5
Publication statusPublished - 17 Apr 2023
MoE publication typeA4 Conference publication
EventIEEE International Conference on Mechatronics - Leicestershire, United Kingdom
Duration: 15 Mar 202317 Mar 2023

Publication series

NameProceedings - 2023 IEEE International Conference on Mechatronics, ICM 2023


ConferenceIEEE International Conference on Mechatronics
Abbreviated titleICM
Country/TerritoryUnited Kingdom


  • IEC 61499
  • Intelligent mechatronics
  • plug and produce
  • swarm intelligence
  • virtual commissioning.


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