Mechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging

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Original languageEnglish
Title of host publicationElectronic Materials, Processes and Packaging for Space (EMPPS), ESA ESTEC, Netherlands, May 20-22, 2014
Publication statusPublished - 2014
MoE publication typeD3 Professional conference proceedings

ID: 564317