Mechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging

Antti Rautiainen, Elmeri Österlund, Hongbo Xu, Vesa Vuorinen, Mervi Paulasto-Kröckel

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Professional

Original language	English
Title of host publication	Electronic Materials, Processes and Packaging for Space (EMPPS), ESA ESTEC, Netherlands, May 20-22, 2014
Publication status	Published - 2014
MoE publication type	D3 Professional conference proceedings

Cite this

@inproceedings{002ada1cbe544ba9b3aa0e2ba9c1ffdc,

title = "Mechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging",

author = "Antti Rautiainen and Elmeri {\"O}sterlund and Hongbo Xu and Vesa Vuorinen and Mervi Paulasto-Kr{\"o}ckel",

year = "2014",

language = "English",

booktitle = "Electronic Materials, Processes and Packaging for Space (EMPPS), ESA ESTEC, Netherlands, May 20-22, 2014",

}

Mechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging. / Rautiainen, Antti; Österlund, Elmeri; Xu, Hongbo et al.
Electronic Materials, Processes and Packaging for Space (EMPPS), ESA ESTEC, Netherlands, May 20-22, 2014. 2014.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Professional

TY - GEN

T1 - Mechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging

AU - Rautiainen, Antti

AU - Österlund, Elmeri

AU - Xu, Hongbo

AU - Vuorinen, Vesa

AU - Paulasto-Kröckel, Mervi

PY - 2014

Y1 - 2014

M3 - Conference article in proceedings

BT - Electronic Materials, Processes and Packaging for Space (EMPPS), ESA ESTEC, Netherlands, May 20-22, 2014

ER -