Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging

Obert Golim^*, Vesa Vuorinen, Tobias Wernicke, Marta Pawlak, Mervi Paulasto-Kröckel

^*Corresponding author for this work

EV Group E. Thallner GmbH

Research output: Contribution to journal › Article › Scientific › peer-review

1 Citation (Scopus)

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Finished
APPLAUSE: Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe
Paulasto-Kröckel, M., Emadi, F., Nieminen, T., Ross, G., Tiwary, N., Golim, O. & Vuorinen, V.
01/05/2019 → 31/10/2022
Project: Business Finland: Other research funding