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Low-Temperature Wafer-Level Bonding with Cu-Sn-In Solid Liquid Interdiffusion for Microsystem Packaging
Obert Golim*, Vesa Vuorinen, Tobias Wernicke, Marta Pawlak, Mervi Paulasto-Kröckel
*Corresponding author for this work
Research output: Contribution to journal › Article › Scientific › peer-review
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