Low-temperature Metal Bonding for Optical Device Packaging

Obert Golim; Vesa Vuorinen; Nikhilendu Tiwary; Glenn Ross; Mervi Paulasto-Kröckel

doi:10.23919/EMPC53418.2021.9585007

Low-temperature Metal Bonding for Optical Device Packaging

Obert Golim^*, Vesa Vuorinen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel

^*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

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Abstract

Low-temperature solid-liquid interdiffusion (SLID) bonding is an attractive alternative for the packaging of optical devices. It reduces global residual stress build up caused by differences in coefficient of thermal expansion (CTE) at elevated temperatures. This work applied the Cu-Sn-In-based SLID bonding method to bond silicon and optically transparent materials at 200 °C. Experimental results show a successful bonding with minor unavoidable misalignment from the CTE mismatch and major misalignment from the bonding alignment process. Microstructural analysis shows the intermetallic compound consists only of Cu6(Sn,In)5 on the bond that is thermally stable up to 600 °C

Original language	English
Title of host publication	Proceedings of 23rd European Microelectronics and Packaging Conference & Exhibition, EMPC 2021
Publisher	IEEE
Number of pages	4
ISBN (Electronic)	978-0-9568086-7-7
ISBN (Print)	978-1-6654-2368-7
DOIs	https://doi.org/10.23919/EMPC53418.2021.9585007
Publication status	Published - 13 Nov 2021
MoE publication type	A4 Article in a conference publication
Event	European Microelectronics and Packaging Conference - Gothenburg, Sweden Duration: 13 Sep 2021 → 16 Sep 2021 Conference number: 23 https://empc2021.org/

Conference

Conference	European Microelectronics and Packaging Conference
Abbreviated title	EMPC
Country/Territory	Sweden
City	Gothenburg
Period	13/09/2021 → 16/09/2021
Internet address	https://empc2021.org/

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title = "Low-temperature Metal Bonding for Optical Device Packaging",

abstract = "Low-temperature solid-liquid interdiffusion (SLID) bonding is an attractive alternative for the packaging of optical devices. It reduces global residual stress build up caused by differences in coefficient of thermal expansion (CTE) at elevated temperatures. This work applied the Cu-Sn-In-based SLID bonding method to bond silicon and optically transparent materials at 200 °C. Experimental results show a successful bonding with minor unavoidable misalignment from the CTE mismatch and major misalignment from the bonding alignment process. Microstructural analysis shows the intermetallic compound consists only of Cu6(Sn,In)5 on the bond that is thermally stable up to 600 °C",

author = "Obert Golim and Vesa Vuorinen and Nikhilendu Tiwary and Glenn Ross and Mervi Paulasto-Kr{\"o}ckel",

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T1 - Low-temperature Metal Bonding for Optical Device Packaging

AU - Golim, Obert

AU - Vuorinen, Vesa

AU - Tiwary, Nikhilendu

AU - Ross, Glenn

AU - Paulasto-Kröckel, Mervi

N1 - Conference code: 23

PY - 2021/11/13

Y1 - 2021/11/13

N2 - Low-temperature solid-liquid interdiffusion (SLID) bonding is an attractive alternative for the packaging of optical devices. It reduces global residual stress build up caused by differences in coefficient of thermal expansion (CTE) at elevated temperatures. This work applied the Cu-Sn-In-based SLID bonding method to bond silicon and optically transparent materials at 200 °C. Experimental results show a successful bonding with minor unavoidable misalignment from the CTE mismatch and major misalignment from the bonding alignment process. Microstructural analysis shows the intermetallic compound consists only of Cu6(Sn,In)5 on the bond that is thermally stable up to 600 °C

AB - Low-temperature solid-liquid interdiffusion (SLID) bonding is an attractive alternative for the packaging of optical devices. It reduces global residual stress build up caused by differences in coefficient of thermal expansion (CTE) at elevated temperatures. This work applied the Cu-Sn-In-based SLID bonding method to bond silicon and optically transparent materials at 200 °C. Experimental results show a successful bonding with minor unavoidable misalignment from the CTE mismatch and major misalignment from the bonding alignment process. Microstructural analysis shows the intermetallic compound consists only of Cu6(Sn,In)5 on the bond that is thermally stable up to 600 °C

U2 - 10.23919/EMPC53418.2021.9585007

DO - 10.23919/EMPC53418.2021.9585007

M3 - Conference contribution

SN - 978-1-6654-2368-7

BT - Proceedings of 23rd European Microelectronics and Packaging Conference & Exhibition, EMPC 2021

PB - IEEE

T2 - European Microelectronics and Packaging Conference

Y2 - 13 September 2021 through 16 September 2021

ER -

Low-temperature Metal Bonding for Optical Device Packaging

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