Low-temperature Metal Bonding for Optical Device Packaging

Obert Golim*, Vesa Vuorinen, Nikhilendu Tiwary, Glenn Ross, Mervi Paulasto-Kröckel

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

4 Citations (Scopus)
181 Downloads (Pure)

Abstract

Low-temperature solid-liquid interdiffusion (SLID) bonding is an attractive alternative for the packaging of optical devices. It reduces global residual stress build up caused by differences in coefficient of thermal expansion (CTE) at elevated temperatures. This work applied the Cu-Sn-In-based SLID bonding method to bond silicon and optically transparent materials at 200 °C. Experimental results show a successful bonding with minor unavoidable misalignment from the CTE mismatch and major misalignment from the bonding alignment process. Microstructural analysis shows the intermetallic compound consists only of Cu6(Sn,In)5 on the bond that is thermally stable up to 600 °C
Original languageEnglish
Title of host publicationProceedings of 23rd European Microelectronics and Packaging Conference & Exhibition, EMPC 2021
PublisherIEEE
Number of pages4
ISBN (Electronic)978-0-9568086-7-7
ISBN (Print)978-1-6654-2368-7
DOIs
Publication statusPublished - 13 Nov 2021
MoE publication typeA4 Conference publication
EventEuropean Microelectronics and Packaging Conference - Gothenburg, Sweden
Duration: 13 Sept 202116 Sept 2021
Conference number: 23
https://empc2021.org/

Conference

ConferenceEuropean Microelectronics and Packaging Conference
Abbreviated titleEMPC
Country/TerritorySweden
CityGothenburg
Period13/09/202116/09/2021
Internet address

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