Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

Hongtao Chen, Maik Mueller, Toni Tuomas Mattila, Jue Li, Xuwei Liu, Klaus-Juerger Wolter, Mervi Paulasto-Kröckel

Research output: Contribution to journalArticleScientificpeer-review

32 Citations (Scopus)
Original languageEnglish
Pages (from-to)2103-2116
JournalJournal of Materials Research
Volume26
Issue number16
DOIs
Publication statusPublished - 2011
MoE publication typeA1 Journal article-refereed

Keywords

  • electron back scatter difraction
  • orientation imaging microscopy
  • polarized light microscopy
  • recrystallization
  • solder interconnection

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