Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

Hongtao Chen; Maik Mueller; Toni Tuomas Mattila; Jue Li; Xuwei Liu; Klaus-Juerger Wolter; Mervi Paulasto-Kröckel

doi:10.1557/jmr.2011.197

Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

Hongtao Chen, Maik Mueller, Toni Tuomas Mattila, Jue Li, Xuwei Liu, Klaus-Juerger Wolter, Mervi Paulasto-Kröckel

Research output: Contribution to journal › Article › Scientific › peer-review

32 Citations (Scopus)

Original language	English
Pages (from-to)	2103-2116
Journal	Journal of Materials Research
Volume	26
Issue number	16
DOIs	https://doi.org/10.1557/jmr.2011.197
Publication status	Published - 2011
MoE publication type	A1 Journal article-refereed

Keywords

electron back scatter difraction
orientation imaging microscopy
polarized light microscopy
recrystallization
solder interconnection

Access to Document

10.1557/jmr.2011.197

http://journals.cambridge.org/action/displayAbstract?fromPage=online&aid=8359344

Raw Materials Research Infrastructure
Maarit Karppinen (Manager)
School of Chemical Engineering
Facility/equipment: Facility

Cite this

@article{1f56fa94d3a54f22bdd460fe5664175e,

title = "Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling",

keywords = "electron back scatter difraction, orientation imaging microscopy, polarized light microscopy, recrystallization, solder interconnection, electron back scatter difraction, orientation imaging microscopy, polarized light microscopy, recrystallization, solder interconnection, electron back scatter difraction, orientation imaging microscopy, polarized light microscopy, recrystallization, solder interconnection",

author = "Hongtao Chen and Maik Mueller and Mattila, {Toni Tuomas} and Jue Li and Xuwei Liu and Klaus-Juerger Wolter and Mervi Paulasto-Kr{\"o}ckel",

year = "2011",

doi = "10.1557/jmr.2011.197",

language = "English",

volume = "26",

pages = "2103--2116",

journal = "Journal of Materials Research",

issn = "0884-2914",

publisher = "MATERIALS RESEARCH SOCIETY",

number = "16",

}

Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling. / Chen, Hongtao; Mueller, Maik; Mattila, Toni Tuomas; Li, Jue; Liu, Xuwei; Wolter, Klaus-Juerger; Paulasto-Kröckel, Mervi.

In: Journal of Materials Research, Vol. 26, No. 16, 2011, p. 2103-2116.

Research output: Contribution to journal › Article › Scientific › peer-review

TY - JOUR

T1 - Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

AU - Chen, Hongtao

AU - Mueller, Maik

AU - Mattila, Toni Tuomas

AU - Li, Jue

AU - Liu, Xuwei

AU - Wolter, Klaus-Juerger

AU - Paulasto-Kröckel, Mervi

PY - 2011

Y1 - 2011

KW - electron back scatter difraction

KW - orientation imaging microscopy

KW - polarized light microscopy

KW - recrystallization

KW - solder interconnection

KW - electron back scatter difraction

KW - orientation imaging microscopy

KW - polarized light microscopy

KW - recrystallization

KW - solder interconnection

KW - electron back scatter difraction

KW - orientation imaging microscopy

KW - polarized light microscopy

KW - recrystallization

KW - solder interconnection

UR - http://journals.cambridge.org/action/displayAbstract?fromPage=online&aid=8359344

U2 - 10.1557/jmr.2011.197

DO - 10.1557/jmr.2011.197

M3 - Article

VL - 26

SP - 2103

EP - 2116

JO - Journal of Materials Research

JF - Journal of Materials Research

SN - 0884-2914

IS - 16

ER -

Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

Keywords

Access to Document

Raw Materials Research Infrastructure

Cite this