Localized recrystallization and cracking behavior of lead-free solder interconnections under thermal cycling

Hong Tao Chen, Toni T. Mattila, Jue Li, Xu Wen Liu, Ming Yu Li, Jorma Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    5 Citations (Scopus)
    Original languageEnglish
    Title of host publicationInternational Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP), Beijing, China, 10-13 August, 2009
    PublisherIEEE CPMT
    Pages562-568
    Publication statusPublished - 2009
    MoE publication typeA4 Article in a conference publication

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