Loading effects in deep silicon etching

J. Karttunen, J. Kiihamäki, S. Franssila

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationSPIE
Pages90-97
Publication statusPublished - 2000
MoE publication typeA4 Article in a conference publication

Keywords

  • etching
  • high aspect ratio
  • ICP
  • microsystems
  • pattern density loading
  • silicon

Cite this

Karttunen, J., Kiihamäki, J., & Franssila, S. (2000). Loading effects in deep silicon etching. In SPIE (pp. 90-97)