Introduction to Encapsulation and Integration of MEMS

Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

Standard

Introduction to Encapsulation and Integration of MEMS. / Kuisma, Heikki; Paulasto-Kröckel, Mervi.

Handbook of Silicon Based MEMS Materials and Technologies: Second Edition. Elsevier Inc., 2015. p. 585-590.

Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

Harvard

Kuisma, H & Paulasto-Kröckel, M 2015, Introduction to Encapsulation and Integration of MEMS. in Handbook of Silicon Based MEMS Materials and Technologies: Second Edition. Elsevier Inc., pp. 585-590. https://doi.org/10.1016/B978-0-323-29965-7.00028-2

APA

Kuisma, H., & Paulasto-Kröckel, M. (2015). Introduction to Encapsulation and Integration of MEMS. In Handbook of Silicon Based MEMS Materials and Technologies: Second Edition (pp. 585-590). Elsevier Inc.. https://doi.org/10.1016/B978-0-323-29965-7.00028-2

Vancouver

Kuisma H, Paulasto-Kröckel M. Introduction to Encapsulation and Integration of MEMS. In Handbook of Silicon Based MEMS Materials and Technologies: Second Edition. Elsevier Inc. 2015. p. 585-590 https://doi.org/10.1016/B978-0-323-29965-7.00028-2

Author

Kuisma, Heikki ; Paulasto-Kröckel, Mervi. / Introduction to Encapsulation and Integration of MEMS. Handbook of Silicon Based MEMS Materials and Technologies: Second Edition. Elsevier Inc., 2015. pp. 585-590

Bibtex - Download

@inbook{594cf2898c374ba2bb92ed9ed538dc8f,
title = "Introduction to Encapsulation and Integration of MEMS",
abstract = "In this chapter the history, status and future developments in the critical areas of MEMS encapsulation and interconnections are briefly introduced. The pressure of cost reduction and the requirements of increasing functionality are driving the miniaturization of packaging. As MEMS and sensors are entering new applications, they need to communicate and act autonomously as a system within physical dimensions which allow embedding them in everyday articles and even in flexible shapes. Therefore, wafer-level packaging and vertical via interconnections between the different components is getting more important. Closer integration of frontend and backend technologies through wafer level and 3D integration type of concepts are needed to enable higher functionality and in the same time to reduce the high manufacturing costs of MEMS packaging. This chapter looks at the main functions of hermetic encapsulation.",
keywords = "Anodic bonding, Encapsulation, Hermetic packaging, Heterogeneous integration, Metallic alloy bonding, Silicon direct bonding",
author = "Heikki Kuisma and Mervi Paulasto-Kr{\"o}ckel",
year = "2015",
month = "1",
day = "1",
doi = "10.1016/B978-0-323-29965-7.00028-2",
language = "English",
isbn = "9780323299657",
pages = "585--590",
booktitle = "Handbook of Silicon Based MEMS Materials and Technologies",
publisher = "Elsevier Inc.",
address = "United States",

}

RIS - Download

TY - CHAP

T1 - Introduction to Encapsulation and Integration of MEMS

AU - Kuisma, Heikki

AU - Paulasto-Kröckel, Mervi

PY - 2015/1/1

Y1 - 2015/1/1

N2 - In this chapter the history, status and future developments in the critical areas of MEMS encapsulation and interconnections are briefly introduced. The pressure of cost reduction and the requirements of increasing functionality are driving the miniaturization of packaging. As MEMS and sensors are entering new applications, they need to communicate and act autonomously as a system within physical dimensions which allow embedding them in everyday articles and even in flexible shapes. Therefore, wafer-level packaging and vertical via interconnections between the different components is getting more important. Closer integration of frontend and backend technologies through wafer level and 3D integration type of concepts are needed to enable higher functionality and in the same time to reduce the high manufacturing costs of MEMS packaging. This chapter looks at the main functions of hermetic encapsulation.

AB - In this chapter the history, status and future developments in the critical areas of MEMS encapsulation and interconnections are briefly introduced. The pressure of cost reduction and the requirements of increasing functionality are driving the miniaturization of packaging. As MEMS and sensors are entering new applications, they need to communicate and act autonomously as a system within physical dimensions which allow embedding them in everyday articles and even in flexible shapes. Therefore, wafer-level packaging and vertical via interconnections between the different components is getting more important. Closer integration of frontend and backend technologies through wafer level and 3D integration type of concepts are needed to enable higher functionality and in the same time to reduce the high manufacturing costs of MEMS packaging. This chapter looks at the main functions of hermetic encapsulation.

KW - Anodic bonding

KW - Encapsulation

KW - Hermetic packaging

KW - Heterogeneous integration

KW - Metallic alloy bonding

KW - Silicon direct bonding

UR - http://www.scopus.com/inward/record.url?scp=85018925293&partnerID=8YFLogxK

U2 - 10.1016/B978-0-323-29965-7.00028-2

DO - 10.1016/B978-0-323-29965-7.00028-2

M3 - Chapter

SN - 9780323299657

SP - 585

EP - 590

BT - Handbook of Silicon Based MEMS Materials and Technologies

PB - Elsevier Inc.

ER -

ID: 17195581