Introduction to Encapsulation and Integration of MEMS

Heikki Kuisma*, Mervi Paulasto-Kröckel

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingChapterScientificpeer-review

Abstract

In this chapter the history, status and future developments in the critical areas of MEMS encapsulation and interconnections are briefly introduced. The pressure of cost reduction and the requirements of increasing functionality are driving the miniaturization of packaging. As MEMS and sensors are entering new applications, they need to communicate and act autonomously as a system within physical dimensions which allow embedding them in everyday articles and even in flexible shapes. Therefore, wafer-level packaging and vertical via interconnections between the different components is getting more important. Closer integration of frontend and backend technologies through wafer level and 3D integration type of concepts are needed to enable higher functionality and in the same time to reduce the high manufacturing costs of MEMS packaging. This chapter looks at the main functions of hermetic encapsulation.

Original languageEnglish
Title of host publicationHandbook of Silicon Based MEMS Materials and Technologies
Subtitle of host publicationSecond Edition
PublisherElsevier Inc.
Pages585-590
Number of pages6
ISBN (Electronic)9780323312233
ISBN (Print)9780323299657
DOIs
Publication statusPublished - 1 Jan 2015
MoE publication typeA3 Part of a book or another research book

Keywords

  • Anodic bonding
  • Encapsulation
  • Hermetic packaging
  • Heterogeneous integration
  • Metallic alloy bonding
  • Silicon direct bonding

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