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Intermetallic Void Formation in Cu-Sn Micro-Connects
Glenn Ross
Department of Electrical Engineering and Automation
Research output
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Thesis
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Doctoral Thesis
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Dive into the research topics of 'Intermetallic Void Formation in Cu-Sn Micro-Connects'. Together they form a unique fingerprint.
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Earth and Planetary Sciences
Void
100%
Intermetallics
100%
Parameter
28%
Fabrication
14%
Detection Method
14%
Hypothesis
14%
Thesis
7%
State
7%
Metal
7%
Industry
7%
Play
7%
Need
7%
Foci
7%
Observation
7%
Stability
7%
Defect
7%
Impurity
7%
Chemical Property
7%
Current Density
7%
Chemical Composition
7%
Compatibility
7%
New Material
7%
Semiconductor
7%
Physics
Intermetallics
100%
Void Growth
100%
Independent Variables
28%
Voids
21%
Electroplating
21%
Detection
14%
Crystal Defect
14%
Performance
7%
Semiconductor
7%
Defects
7%
Foci
7%
Stability
7%
Impurities
7%
Chemical Property
7%
Chemical Composition
7%
Kirkendall Effect
7%
Chemistry
Intermetallic Compound
100%
Procedure
28%
Electrodeposition
21%
Device
14%
Chemistry
7%
Industry
7%
Metal
7%
Liquid Film
7%
Impurity
7%
Density
7%
Current Density
7%
Semiconductor
7%
Interdiffusion
7%
Reduction
7%
Crystal Defect
7%
Chemical Property
7%
Material Science
Intermetallics
100%
Electroplating
21%
Residual Stress
14%
Material
14%
Defect
7%
Semiconductor Material
7%
Devices
7%
Metal
7%
Impurity
7%
Density
7%
Defect Density
7%
Microelectronics
7%
Chemical Property
7%
Chemical State
7%
Device Fabrication
7%