Interfacial reactions between SnAg1.0Ti and Ni metallization

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	English
Pages (from-to)	2030-2034
Journal	Journal of Materials Science: Materials in Electronics
Volume	23
Issue number	XX
DOIs	https://doi.org/10.1007/s10854-012-0698-5
Publication status	Published - 2012
MoE publication type	A1 Journal article-refereed

Keywords

@article{fb616db58eeb4367a5e81fe9c51bd4de,

title = "Interfacial reactions between SnAg1.0Ti and Ni metallization",

keywords = "electromigration, vibration, electromigration, vibration, electromigration, vibration",

author = "Tomi Laurila and Hongqun Dong and Vesa Vuorinen",

year = "2012",

doi = "10.1007/s10854-012-0698-5",

language = "English",

volume = "23",

pages = "2030--2034",

journal = "Journal of Materials Science: Materials in Electronics",

issn = "0957-4522",

publisher = "Springer",

number = "XX",

}

TY - JOUR

T1 - Interfacial reactions between SnAg1.0Ti and Ni metallization

AU - Laurila, Tomi

AU - Dong, Hongqun

AU - Vuorinen, Vesa

PY - 2012

Y1 - 2012

KW - electromigration

KW - vibration

KW - electromigration

KW - vibration

KW - electromigration

KW - vibration

U2 - 10.1007/s10854-012-0698-5

DO - 10.1007/s10854-012-0698-5

M3 - Article

SN - 0957-4522

VL - 23

SP - 2030

EP - 2034

JO - Journal of Materials Science: Materials in Electronics

JF - Journal of Materials Science: Materials in Electronics

IS - XX

ER -