@article{2d2a5df004d94ace88d96737cd831bf7,
title = "Interfacial Phase Formation in Sn-Ag-Cu Solder Joints with Ni/Au Coated Boards",
keywords = "black pad, intermetallics, lead-free, thermodynamics, black pad, intermetallics, lead-free, thermodynamics, black pad, intermetallics, lead-free, thermodynamics",
author = "Kejun Zeng and Vesa Vuorinen and Kivilahti, {Jorma K.}",
year = "2002",
language = "English",
volume = "25",
pages = "162--167",
journal = "IEEE Transactions on Components, Packaging and Manufacturing Technology",
issn = "2156-3985",
publisher = "IEEE",
}