Interfacial Phase Formation in Sn-Ag-Cu Solder Joints with Ni/Au Coated Boards

Kejun Zeng, Vesa Vuorinen, Jorma K. Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    Original languageEnglish
    Pages (from-to)162-167
    JournalIEEE CPMT
    Volume25
    Publication statusPublished - 2002
    MoE publication typeA1 Journal article-refereed

    Keywords

    • black pad
    • intermetallics
    • lead-free
    • thermodynamics

    Cite this