Interconnections based on Bi-coated SnAg solder balls

Tia-Marje Korhonen, Vesa Vuorinen, Jorma K. Kivilahti

Research output: Contribution to journal › Article › Scientific › peer-review

Original language	English
Pages (from-to)	151-520
Journal	IEEE Transactions on Advanced packaging
Volume	24
Issue number	4
Publication status	Published - 2002
MoE publication type	A1 Journal article-refereed

Keywords

@article{473a5a770beb484caa4dde07f8e14ea0,

title = "Interconnections based on Bi-coated SnAg solder balls",

keywords = "Bi-coating, lead-free, thermodynamics, Bi-coating, lead-free, thermodynamics, Bi-coating, lead-free, thermodynamics",

author = "Tia-Marje Korhonen and Vesa Vuorinen and Kivilahti, {Jorma K.}",

year = "2002",

language = "English",

volume = "24",

pages = "151--520",

journal = "IEEE Transactions on Advanced packaging",

publisher = "IEEE",

number = "4",

}

TY - JOUR

T1 - Interconnections based on Bi-coated SnAg solder balls

AU - Korhonen, Tia-Marje

AU - Vuorinen, Vesa

AU - Kivilahti, Jorma K.

PY - 2002

Y1 - 2002

KW - Bi-coating

KW - lead-free

KW - thermodynamics

KW - Bi-coating

KW - lead-free

KW - thermodynamics

KW - Bi-coating

KW - lead-free

KW - thermodynamics

M3 - Article

VL - 24

SP - 151

EP - 520

JO - IEEE Transactions on Advanced packaging

JF - IEEE Transactions on Advanced packaging

IS - 4

ER -