@inproceedings{5a7dc85f4a0e4dde83279ff754f1ccc2,
title = "Integrating Active and Passive Components into Rigid Substrates",
keywords = "active component integration, contactless smartcard, fully additive PWB technology, HDI substrates, IBM-technology, passive component integration, solderless, active component integration, contactless smartcard, fully additive PWB technology, HDI substrates, IBM-technology, passive component integration, solderless, active component integration, contactless smartcard, fully additive PWB technology, HDI substrates, IBM-technology, passive component integration, solderless",
author = "R. Tuominen and J. Kivilahti",
year = "2000",
language = "English",
pages = "214--218",
editor = "P{\'a}l N{\'e}meth",
booktitle = "23rd International Spring Seminar on Electronics Technology, Balatonf{\"u}red, Unkari, 2000",
publisher = "Budapest University of Technology and Economics",
address = "Hungary",
}