Integrating Active and Passive Components into Rigid Substrates

R. Tuominen, J. Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publication23rd International Spring Seminar on Electronics Technology, Balatonfüred, Unkari, 2000
    EditorsPál Németh
    Place of PublicationBalatonfüred, Unkari
    PublisherDepartment of Electronics Technology, Budabest University of Technology and Ecnomics
    Pages214-218
    Publication statusPublished - 2000
    MoE publication typeA4 Article in a conference publication

    Keywords

    • active component integration
    • contactless smartcard
    • fully additive PWB technology
    • HDI substrates
    • IBM-technology
    • passive component integration
    • solderless

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