Integrating Active and Passive Components into Rigid Flexible HDI Substrates

R. Tuominen, J. Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationIMAPS Nordic Conference, Helsingör, 2000
    EditorsPaul Collander
    Place of PublicationHelsingör, Tanska
    PublisherIMAPS
    Pages46-50
    Publication statusPublished - 2000
    MoE publication typeA4 Article in a conference publication

    Keywords

    • active component integration
    • Cu/Cu -interconnection
    • fully additive PWB technology
    • HDI substrates
    • IMP-technology
    • solderless

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