@inproceedings{72dba9051b3b4542990720f10889fda8,
title = "Integrated Module Board (IMB): An Advanced Manufacturing Technology for Embedding Active Components Inside Organic Substrate",
keywords = "3D packaging, embedding, integrated module board, MB, miniaturization, 3D packaging, embedding, integrated module board, MB, miniaturization, 3D packaging, embedding, integrated module board, MB, miniaturization",
author = "P. Palm and R. Tuominen and A. Kivikero",
year = "2004",
language = "English",
pages = "4",
booktitle = "Electronic Components and Technology Conference (ECTC) 2004, Las Vegas, June 1-4, 2004",
}