Integrated Module Board (IMB): An Advanced Manufacturing Technology for Embedding Active Components Inside Organic Substrate

P. Palm, R. Tuominen, A. Kivikero

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    18 Citations (Scopus)
    Original languageEnglish
    Title of host publicationElectronic Components and Technology Conference (ECTC) 2004, Las Vegas, June 1-4, 2004
    Pages4
    Publication statusPublished - 2004
    MoE publication typeA4 Article in a conference publication

    Keywords

    • 3D packaging
    • embedding
    • integrated module board
    • MB
    • miniaturization

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