Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing

Hongtao Chen, Jin Han, Jue Li, Mingyu Li

    Research output: Contribution to journalArticleScientificpeer-review

    48 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)1112-1120
    JournalMicroelectronics Reliability
    Volume52
    Issue number1
    DOIs
    Publication statusPublished - 2012
    MoE publication typeA1 Journal article-refereed

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