Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing

Hongtao Chen, Jin Han, Jue Li, Mingyu Li

Research output: Contribution to journal › Article › Scientific › peer-review

48 Citations (Scopus)

Original language	English
Pages (from-to)	1112-1120
Journal	Microelectronics Reliability
Volume	52
Issue number	1
DOIs	https://doi.org/10.1016/j.microrel.2012.01.009
Publication status	Published - 2012
MoE publication type	A1 Journal article-refereed

Access to Document

@article{5f3e2e040f504e6cb0e96857a6a0fc79,

title = "Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing",

author = "Hongtao Chen and Jin Han and Jue Li and Mingyu Li",

year = "2012",

doi = "10.1016/j.microrel.2012.01.009",

language = "English",

volume = "52",

pages = "1112--1120",

journal = "Microelectronics Reliability",

issn = "0026-2714",

number = "1",

}

TY - JOUR

T1 - Inhomogeneous deformation and microstructure evolution of Sn-Ag-based solder interconnects during thermal cycling and shear testing

AU - Chen, Hongtao

AU - Han, Jin

AU - Li, Jue

AU - Li, Mingyu

PY - 2012

Y1 - 2012

UR - http://dx.doi.org/10.1016/j.microrel.2012.01.009

U2 - 10.1016/j.microrel.2012.01.009

DO - 10.1016/j.microrel.2012.01.009

M3 - Article

VL - 52

SP - 1112

EP - 1120

JO - Microelectronics Reliability

JF - Microelectronics Reliability

SN - 0026-2714

IS - 1

ER -