Influence of thiourea and thiourea ageing on the electrodeposition of copper from acid sulfate solutions studied by the ring-disc technique

G. Fabricius, K. Kontturi, G. Sundholm

    Research output: Contribution to journalArticleScientificpeer-review

    50 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)1179-1183
    JournalJournal of Applied Electrochemistry
    Volume26
    Publication statusPublished - 1996
    MoE publication typeA1 Journal article-refereed

    Keywords

    • additive
    • copper electrodeposition
    • thiourea

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