Abstract
This brief introduces new methodologies to design microstrip line crossovers on a high-speed interconnection circuit. The crossover is based on a simple square patch, which employs TM100 and TM001 to achieve mode orthogonality so that two sets of intersecting signals can transmit along microstrip lines with a high isolation. Compared with rectangular waveguide crossovers that employ high modes, namely TE102 and TE201, it shows advantages like a smaller size and easier manufacturing. Then, the relevant techniques for performance improvement, including radiation suppression and bandwidth widening, are studied for practical circuit designs. Finally, based on the sub-element technique, the study designs a controllable frequency response for two intersecting signals and miniaturization of patch based crossovers. Two examples are implemented, manufactured and measured to justify the validity of the sub-element technology. In addition, the design steps of this method are simplified compared with relying on full-wave simulations entirely.
Original language | English |
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Pages (from-to) | 3774-3778 |
Number of pages | 5 |
Journal | IEEE Transactions on Circuits and Systems II: Express Briefs |
Volume | 69 |
Issue number | 9 |
Early online date | 2022 |
DOIs | |
Publication status | Published - Sept 2022 |
MoE publication type | A1 Journal article-refereed |
Keywords
- bandpass responses
- Bandwidth
- bandwidth widening.
- controllable frequency
- Coplanar waveguides
- Electromagnetic waveguides
- Filtering
- patch-based crossover
- Propagation losses
- Resonators
- Scattering parameters
- sub-element technology
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Aalto Electronics-ICT
Jussi Ryynänen (Manager)
Department of Electronics and NanoengineeringFacility/equipment: Facility