Impact of printed wiring board coatings on the reliability of lead-free chip-scale packages interconnections

Toni T. Mattila, Vesa Vuorinen, Jorma K. Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    88 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)3214-3223
    JournalJournal of Materials Research
    Volume19
    Issue number11
    Publication statusPublished - 2004
    MoE publication typeA1 Journal article-refereed

    Keywords

    • cyclic thermal shock loading
    • interconnection reliability
    • lead-free soldering
    • microstructure
    • recrystallization

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