Hygroskopic Moisture Physical Behaviour of Finnish Plywood and LVL

M. Lehtinen, I. Absetz, J. Sihvonen

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publication2nd Co-operation Symposium in Building Physics Between Chongqing Jianzhu University of China And Helsinki University of Technology of Finland, September 16-25.1996
    Place of PublicationChongqing, China
    PublisherChongqing Jianzhu University
    Publication statusPublished - 1996
    MoE publication typeA4 Article in a conference publication


    • adhesive
    • adsorption
    • diffusion
    • equilibrium moisture content
    • high temperature
    • LVL
    • plywood
    • relative humidity
    • wood

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