Hybrid microassembly is a novel technology that joins traditional robotic pick-and-place and self-assembly of microsystems. Using existing high-speed robotic tools such as die bonders, a throughput of up to tens of thousands unit per hour can be achieved for the fast but coarse feeding of dies to the targets of assembly. Using capillary self-alignment, we can achieve micron accuracy positioning simultaneously with the high speed feeding. Combined with appropriately designed interfaces, permanent fixing and electric connections can be successfully implemented. In this paper, we discuss the progress of the hybrid microassembly technology and its applications in 3D integration of thin dies on wafers, integration of small dies on lead-frames, and integration of surface emitting lasers. This paper summarizes the preliminary results of EU FP7 project FAB2ASM (2010-2013, URL: www.fab2asm.eu).
|Publication status||Published - 1 Jan 2013|
|MoE publication type||Not Eligible|
|Event||Smart Systems Integration Conference - Amsterdam, Netherlands|
Duration: 13 Mar 2013 → 14 Mar 2013
|Conference||Smart Systems Integration Conference|
|Period||13/03/2013 → 14/03/2013|