@inproceedings{acd8a91bbfa048d7b16d53106be9fd09,
title = "High.speed mechanical impact reliability of solder interconnections in high-power LEDs",
keywords = "light emitting diodes, solid state lighting,, mechanical reliability, solder interconnection, light emitting diodes, solid state lighting,, mechanical reliability, solder interconnection, light emitting diodes, solid state lighting,, mechanical reliability, solder interconnection",
author = "Jussi Hokka and Jo Caers and \{De Jong\}, Marcel and Wil Peels and Bob Sykes and Kouchi Zhang and Mervi Paulasto-Kr{\"o}ckel",
year = "2010",
language = "English",
isbn = "978-1-4244-7026-6",
pages = "1--5",
booktitle = "EuroSimE Thermo, Mechanical \& Multiphysics Simulation, and Experiments in Microelectronics and Microsystems (EuroSimE), Bourdeaux, France, 2010",
publisher = "IEEE",
address = "United States",
}