High frequency substrate technologies for the realisation of software programmable metasurfaces on pcb hardware platforms with integrated controller nodes

D. Manessis, M. Seckel, Fu Liu, O. Tsilipakos, A. Pitilakis, A. Tasolamprou, K. Kossifos, G. Varnava, C. Liaskos, M. Kafesaki, C. M. Soukoulis, Sergei Tretiakov, J. Georgiou, A. Ostmann, R. Aschenbrenner, M. Schneider-Ramelow, K. D. Lang

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

4 Citations (Scopus)
175 Downloads (Pure)

Abstract

The proposed work is performed in the framework of the FET-EU project ' VISORSURF^{J\prime}, which has undertaken research activities on the emerging concepts of metamaterials that can be software programmable and adapt their properties. In the realm of electromagnetism (EM), the field of metasurfaces (MSF) has reached significant breakthroughs in correlating the micro- or nano-structure of artificial planar materials to their end properties. MSFs exhibit physical properties not found in nature, such as negative or smaller-than-unity refraction index, allowing for EM cloaking of objects, reflection cancellation from a given surface and EM energy concentration in as-tight-as-possible spaces. The VISORSURF main objective is the development of a hardware platform, the Hypersurface, whose electromagnetic behavior can be defined programmatically. The key enablers for this are the metasurfaces whose electromagnetic properties depend on their internal structure. The Hypersurface hardware platform will be a 4-layer build-up of high frequency PCB substrate materials and will merge the metasurfaces with custom electronic controller nodes at the bottom of the PCB hardware platform. These electronic controllers build a nanonetwork which receives external programmatic commands and alters the metasurface structure, yielding a desired electromagnetic behavior for the Hypersurface platform. This paper will elaborate on how large scale PCB technologies are deployed for the economical manufacturing of the 4-layer Hypersurface PCB hardware platform with a size of 9Jx1 2J', having copper metasurface patches on the top of the board and the electronic controllers as 2mmx2mm WLCSP chips at 400\mum pitch assembled at the bottom of the platform. The PCB platform designs have stemmed from EM modeling iterations of the whole stack of high frequency laminates taking into account also the electronic features of the controller nodes. The manufacturing processes for the realization of the selected PCB architectures will be discussed in detail.

Original languageEnglish
Title of host publication2019 22nd European Microelectronics and Packaging Conference and Exhibition, EMPC 2019
PublisherIEEE
ISBN (Electronic)9780956808660
DOIs
Publication statusPublished - 16 Sept 2019
MoE publication typeA4 Conference publication
EventEuropean Microelectronics and Packaging Conference - Pisa, Italy
Duration: 16 Sept 201919 Sept 2019
Conference number: 22

Publication series

NameEuropean Microelectronics and Packaging Conference
ISSN (Print)2165-2341

Conference

ConferenceEuropean Microelectronics and Packaging Conference
Abbreviated titleEMPC
Country/TerritoryItaly
CityPisa
Period16/09/201919/09/2019

Keywords

  • High frequency substrates
  • Metamaterials
  • Metasurfaces
  • Software defined materials

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  • VISORSURF: A Hardware Platform for Software-driven Functional Metasurfaces

    Tretiakov, S. (Principal investigator), Asadchy, V. (Project Member), Liu, F. (Project Member), Cuesta, F. (Project Member), Ptitcyn, G. (Project Member), Wang, X. (Project Member), Mirmoosa, M. (Project Member), Jayathurathnage, P. (Project Member) & Tzarouchis, D. (Project Member)

    01/01/201731/12/2020

    Project: EU: Framework programmes funding

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