@inproceedings{1c24fadf37de495182cab749603b0e4f,
title = "High Density Flip Chip Interconnections Produced with In-situ Underfills and Compatible Coatings",
keywords = "Compatible Solder Coatings, Fine Pitch, Flip Chip, Intermetallic-Free, No-flow underfiller, Reflow underfiller, Compatible Solder Coatings, Fine Pitch, Flip Chip, Intermetallic-Free, No-flow underfiller, Reflow underfiller, Compatible Solder Coatings, Fine Pitch, Flip Chip, Intermetallic-Free, No-flow underfiller, Reflow underfiller",
author = "J.K. Kivilahti and K. Puhakka",
year = "1998",
language = "English",
pages = "96--100",
booktitle = "3rd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Binghamton NY,USA, 27.- 30.9.1998",
publisher = "IEEE",
address = "United States",
}