High Density Flip Chip Interconnections Produced with In-situ Underfills and Compatible Coatings

J.K. Kivilahti, K. Puhakka

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publication3rd International Conference on Adhesive Joining & Coating Technology in Electronics Manufacturing, Binghamton NY,USA, 27.- 30.9.1998
    PublisherIEEE Components, Packaging and Manufacturing Technology Society
    Publication statusPublished - 1998
    MoE publication typeA4 Article in a conference publication


    • Compatible Solder Coatings
    • Fine Pitch
    • Flip Chip
    • Intermetallic-Free
    • No-flow underfiller
    • Reflow underfiller

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