Fully additive process for multilayer PCB fabrication

J.K. Kivilahti, A. Kujala

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationThe IMAPS Nordic 35th Annual Conference, Stockholm, Sweden, 20.-23.9.1998
    PublisherIMAPS
    Pagess. M4-1 - M4-5
    Publication statusPublished - 1998
    MoE publication typeA4 Article in a conference publication

    Keywords

    • Additive
    • Electroles copper deposition
    • High Density
    • Printed Wiring Board; PWB

    Cite this