Formation of thermomechanical interconnection stresses in a high-end portable product

Juha Karppinen, Toni Mattila, Jorma Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    6 Citations (Scopus)
    Original languageEnglish
    Title of host publicationElectronics System-Integration Technology Conference (ESTC) 2008, Greenwich, Lontoo, Iso-Britannia, 1.-4.9.2008
    EditorsPackaging IEEE Components
    Place of PublicationEurooppa
    Publication statusPublished - 2008
    MoE publication typeA4 Article in a conference publication

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