Formation of thermomechanical interconnection stresses in a high-end portable product

Juha Karppinen, Toni Mattila, Jorma Kivilahti

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

6 Citations (Scopus)

Original language	English
Title of host publication	Electronics System-Integration Technology Conference (ESTC) 2008, Greenwich, Lontoo, Iso-Britannia, 1.-4.9.2008
Editors	Packaging IEEE Components
Place of Publication	Eurooppa
Publication status	Published - 2008
MoE publication type	A4 Conference publication

Cite this

@inproceedings{c3ba9ed2e7954fafa9394cf376e1808f,

title = "Formation of thermomechanical interconnection stresses in a high-end portable product",

author = "Juha Karppinen and Toni Mattila and Jorma Kivilahti",

year = "2008",

language = "English",

editor = "\{IEEE Components\}, Packaging",

booktitle = "Electronics System-Integration Technology Conference (ESTC) 2008, Greenwich, Lontoo, Iso-Britannia, 1.-4.9.2008",

}

Formation of thermomechanical interconnection stresses in a high-end portable product. / Karppinen, Juha; Mattila, Toni; Kivilahti, Jorma.
Electronics System-Integration Technology Conference (ESTC) 2008, Greenwich, Lontoo, Iso-Britannia, 1.-4.9.2008. ed. / Packaging IEEE Components. Eurooppa, 2008.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Formation of thermomechanical interconnection stresses in a high-end portable product

AU - Karppinen, Juha

AU - Mattila, Toni

AU - Kivilahti, Jorma

PY - 2008

Y1 - 2008

UR - https://www.scopus.com/pages/publications/58149085204

M3 - Conference article in proceedings

BT - Electronics System-Integration Technology Conference (ESTC) 2008, Greenwich, Lontoo, Iso-Britannia, 1.-4.9.2008

A2 - IEEE Components, Packaging

CY - Eurooppa

ER -