Formation of mechanical strains in the component board of a high-end handheld product during shock impact

Juha Karppinen; Jyri Pakarinen; Toni Tuomas Mattila; Mervi Paulasto-Kröckel

Formation of mechanical strains in the component board of a high-end handheld product during shock impact

Juha Karppinen, Jyri Pakarinen, Toni Tuomas Mattila, Mervi Paulasto-Kröckel

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

3 Citations (Scopus)

Original language	English
Title of host publication	ESTC 3rd Electronic System-Integration Technology Conference (ESTC), Berliini, Saksa, 14-16.9.2010
Publisher	IEEE CPMT
ISBN (Electronic)	978-1-4244-8554-3
ISBN (Print)	978-1-4244-8553-6
Publication status	Published - 2010
MoE publication type	A4 Article in a conference publication

Keywords

handheld product, drop test
testing, reliability, mechanical shock, interconnection,

Access to Document

http://dx.doi.org/10.1109/ESTC.2010.5642847

Cite this

@inproceedings{82d0df59819940b38b81b3e4776c7f24,

title = "Formation of mechanical strains in the component board of a high-end handheld product during shock impact",

keywords = "handheld product, drop test, testing, reliability, mechanical shock, interconnection,, handheld product, drop test, testing, reliability, mechanical shock, interconnection,, handheld product, drop test, testing, reliability, mechanical shock, interconnection,",

author = "Juha Karppinen and Jyri Pakarinen and Mattila, {Toni Tuomas} and Mervi Paulasto-Kr{\"o}ckel",

year = "2010",

language = "English",

isbn = "978-1-4244-8553-6",

booktitle = "ESTC 3rd Electronic System-Integration Technology Conference (ESTC), Berliini, Saksa, 14-16.9.2010",

publisher = "IEEE CPMT",

}

Formation of mechanical strains in the component board of a high-end handheld product during shock impact. / Karppinen, Juha; Pakarinen, Jyri; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi.

ESTC 3rd Electronic System-Integration Technology Conference (ESTC), Berliini, Saksa, 14-16.9.2010. IEEE CPMT, 2010.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › Scientific › peer-review

TY - GEN

T1 - Formation of mechanical strains in the component board of a high-end handheld product during shock impact

AU - Karppinen, Juha

AU - Pakarinen, Jyri

AU - Mattila, Toni Tuomas

AU - Paulasto-Kröckel, Mervi

PY - 2010

Y1 - 2010

KW - handheld product, drop test

KW - testing, reliability, mechanical shock, interconnection,

KW - handheld product, drop test

KW - testing, reliability, mechanical shock, interconnection,

KW - handheld product, drop test

KW - testing, reliability, mechanical shock, interconnection,

UR - http://dx.doi.org/10.1109/ESTC.2010.5642847

M3 - Conference contribution

SN - 978-1-4244-8553-6

BT - ESTC 3rd Electronic System-Integration Technology Conference (ESTC), Berliini, Saksa, 14-16.9.2010

PB - IEEE CPMT

ER -