Formation of Intermetallic Compounds in Solder Joints and Its Effects on Joint Reliability

K. Zeng, W. Peng, J. Kivilahti

    Research output: Working paperProfessional

    Original languageEnglish
    Place of PublicationEspoo
    Pages50
    Publication statusPublished - 2000
    MoE publication typeD4 Published development or research report or study

    Publication series

    NameUniversity Publication Series, HUT-EPT-2
    PublisherHelsinki University of Technology

    Keywords

    • IMC
    • soldering

    Cite this