Formation of Interfacial Microstructure in Brazing of the Silicon Nitride with Ti-Activated Ag-Cu filler alloys

M. Paulasto, J. Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    Original languageEnglish
    Pages (from-to)1209-1214
    JournalScripta Metallurgica et Materialia
    Volume32
    Issue number8
    Publication statusPublished - 1995
    MoE publication typeA1 Journal article-refereed

    Keywords

    • brazing
    • metals and ceramics

    Cite this