Flip Chip Die Attach Development for Multichip Mechatronics Power Packages

Research output: Contribution to journalArticleScientificpeer-review

12 Citations (Scopus)

Abstract

New package innovations are needed to address the next generation system requirements of the automotive market. Enhanced system functionality from semiconductor components and overall cost reduction demands drive multichip package solutions. The use of semiconductor devices to switch, control and monitor high current loads will integrate logic and power devices on a common substrate with requirements for effective power dissipation, current carrying capability and fine width conductor features for the control device and interconnections. To achieve these goals Motorola's Advanced Interconnection Systems Laboratory, Munich, has developed a new package concept, a multichip mechatronics power package, utilizing flip chip die attach technology and electroplated eutectic SnPb solder bumps. With the goal to deliver an advanced package platform to cover different power levels in the system architecture,the several substrate technologies were evaluated.
Original languageEnglish
Pages (from-to)300-306
Number of pages7
JournalIEEE Transactions on Electronics Packaging Manufacturing
Volume24
Issue number4
DOIs
Publication statusPublished - 2001
MoE publication typeA1 Journal article-refereed

Keywords

  • automotive mechatronics
  • flip chip reliability
  • insulated metal substrate
  • multichip pacjaking
  • power dissipation

Fingerprint Dive into the research topics of 'Flip Chip Die Attach Development for Multichip Mechatronics Power Packages'. Together they form a unique fingerprint.

  • Cite this