Finite element modeling for reliability assessment of solder interconnections in a power transistor

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Original languageEnglish
Title of host publicationESTC 4th Electronic System-Integration Technology Conference, Sept. 17-20, 2012, Amsterdam
PublisherIEEE CPMT
ISBN (Print)978-1-4673-4645-0
Publication statusPublished - 2012
MoE publication typeA4 Article in a conference publication

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