Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests

Jue Li, Hongbo Xu, Jussi Hokka, Toni T. Mattila, Hongtao Chen, Mervi Paulasto-Kröckel

Research output: Contribution to journalArticleScientificpeer-review

11 Citations (Scopus)
Original languageEnglish
Pages (from-to)161-167
JournalSoldering and Surface Mount Technology
Volume23
Issue number3
DOIs
Publication statusPublished - 2011
MoE publication typeA1 Journal article-refereed

Keywords

  • crack growth
  • finite element analysis
  • fracture
  • lifetime prediction
  • product reliability
  • reliability
  • SAC
  • shock tests
  • SnAgCu
  • solders
  • thermal testing

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