FEM Modelling of Ultrasound Enhanced Electrospinning (USES)

Joni Mäkinen, Petteri Helander, Tuomas Puranen, Joel Hunnakko, Karin Kogermann, Ivo Laidmäe, Heikki Nieminen, Ari Salmi, Jyrki Heinämäki, Edward Hæggström

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

Abstract

We present simulation efforts towards trying to understand ultrasound enhanced electrospinning (USES). Compared to traditional electrospinning this method uses ultrasound to produce an acoustic fountain on the free surface of the spinning liquid. This fountain is used as a base for the electrospinning process by applying a high-voltage between a collector plate and the liquid. The simulation predictions for the acoustic fountain height as a function of acoustic power are compared to measured values. Then, the effect of electrostatic deformation of the fountain, when a high-voltage is applied, is studied by simulations as a function of initial fountain height.
Original languageEnglish
Title of host publication2019 IEEE International Ultrasonics Symposium (IUS)
PublisherIEEE
Pages2511-2514
Number of pages4
ISBN (Electronic)978-1-7281-4596-9
DOIs
Publication statusPublished - 9 Dec 2019
MoE publication typeA4 Article in a conference publication
EventIEEE International Ultrasonics Symposium - Glasgow, United Kingdom
Duration: 6 Oct 20199 Oct 2019

Publication series

NameIEEE International Ultrasonics Symposium
PublisherIEEE
ISSN (Print)1948-5719
ISSN (Electronic)1948-5727

Conference

ConferenceIEEE International Ultrasonics Symposium
Abbreviated titleIUS
CountryUnited Kingdom
CityGlasgow
Period06/10/201909/10/2019

Keywords

  • acoustic fountain
  • electrospinning
  • FEM
  • ultrasound
  • ultrasound enhance electrospinning

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    Mäkinen, J., Helander, P., Puranen, T., Hunnakko, J., Kogermann, K., Laidmäe, I., ... Hæggström, E. (2019). FEM Modelling of Ultrasound Enhanced Electrospinning (USES). In 2019 IEEE International Ultrasonics Symposium (IUS) (pp. 2511-2514). [8926132] (IEEE International Ultrasonics Symposium). IEEE. https://doi.org/10.1109/ULTSYM.2019.8926132