Feasibility of Lead-free Solder Alloys as Filler Material for Z-axis Adhesives

P. Savolainen, J. Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationISHM-Nordic 32nd Annual Conference, Helsinki, 25-28.9.1994
    PublisherISHM Nordic
    Pages201-206
    Publication statusPublished - 1994
    MoE publication typeA4 Article in a conference publication

    Keywords

    • anisotropic adhessive
    • lead-free solder

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