Fast-diffusing interstitial copper, iron and nickel in silicon

Jeanette Lindroos, David P. Fenning, Daniel J. Backlund, Yacine Boulfrad, Tonio Buonassisi, Stefan K. Estreicher, Hele Savin

Research output: Chapter in Book/Report/Conference proceedingConference contributionScientific

Original languageEnglish
Title of host publication25th Nordic Semiconductor Meeting, Espoo, Finland, June 9-12, 2013
Publication statusPublished - 2013
MoE publication typeB3 Non-refereed article in conference proceedings

Cite this

Lindroos, J., Fenning, D. P., Backlund, D. J., Boulfrad, Y., Buonassisi, T., Estreicher, S. K., & Savin, H. (2013). Fast-diffusing interstitial copper, iron and nickel in silicon. In 25th Nordic Semiconductor Meeting, Espoo, Finland, June 9-12, 2013