Failure Modes of Solder Interconnections under Mechanical Shock Loading at Elevated Temperatures

T.T. Mattila, J. Simecek, J.K. Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationthe 1st Electronics Systemintegration Technology Conference, Dresden Germany, September 5 to 7 2006
    Publication statusPublished - 2006
    MoE publication typeA4 Article in a conference publication


    • shock loading
    • solder interconnections

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