Failure Modes of Solder Interconnections under Mechanical Shock Loading at Elevated Temperatures

T.T. Mattila, J. Simecek, J.K. Kivilahti

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Original language	English
Title of host publication	the 1st Electronics Systemintegration Technology Conference, Dresden Germany, September 5 to 7 2006
Publication status	Published - 2006
MoE publication type	A4 Conference publication

Keywords

@inproceedings{81ff435cc2034c93908072abbc59d609,

title = "Failure Modes of Solder Interconnections under Mechanical Shock Loading at Elevated Temperatures",

keywords = "shock loading, solder interconnections, shock loading, solder interconnections, shock loading, solder interconnections",

author = "T.T. Mattila and J. Simecek and J.K. Kivilahti",

year = "2006",

language = "English",

booktitle = "the 1st Electronics Systemintegration Technology Conference, Dresden Germany, September 5 to 7 2006",

}

Failure Modes of Solder Interconnections under Mechanical Shock Loading at Elevated Temperatures. / Mattila, T.T.; Simecek, J.; Kivilahti, J.K.
the 1st Electronics Systemintegration Technology Conference, Dresden Germany, September 5 to 7 2006. 2006.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Failure Modes of Solder Interconnections under Mechanical Shock Loading at Elevated Temperatures

AU - Mattila, T.T.

AU - Simecek, J.

AU - Kivilahti, J.K.

PY - 2006

Y1 - 2006

KW - shock loading

KW - solder interconnections

KW - shock loading

KW - solder interconnections

KW - shock loading

KW - solder interconnections

M3 - Conference article in proceedings

BT - the 1st Electronics Systemintegration Technology Conference, Dresden Germany, September 5 to 7 2006

ER -