Failure Mechanisms of Lead-free Chip Scale Package Interconnections Under Fast Mechanical Loading

Research output: Contribution to journalArticleScientificpeer-review

Researchers

  • Toni Mattila
  • Jorma Kivilahti

Research units

Details

Original languageEnglish
Pages (from-to)969-976
JournalJournal of Electronic Materials
Volume34
Issue number7
Publication statusPublished - 2005
MoE publication typeA1 Journal article-refereed

ID: 3627450