Failure Mechanisms of Lead-free Chip Scale Package Interconnections Under Fast Mechanical Loading

Toni Mattila, Jorma Kivilahti

Research output: Contribution to journal › Article › Scientific › peer-review

78 Citations (Scopus)

Original language	English
Pages (from-to)	969-976
Journal	Journal of Electronic Materials
Volume	34
Issue number	7
Publication status	Published - 2005
MoE publication type	A1 Journal article-refereed

Cite this

@article{335c72d0d1014cb58b87ab1c49d75c39,

title = "Failure Mechanisms of Lead-free Chip Scale Package Interconnections Under Fast Mechanical Loading",

author = "Toni Mattila and Jorma Kivilahti",

year = "2005",

language = "English",

volume = "34",

pages = "969--976",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

number = "7",

}