Failure Mechanisms of Lead-free Chip Scale Package Interconnections Under Fast Mechanical Loading

Toni Mattila, Jorma Kivilahti

    Research output: Contribution to journalArticleScientificpeer-review

    78 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)969-976
    JournalJournal of Electronic Materials
    Volume34
    Issue number7
    Publication statusPublished - 2005
    MoE publication typeA1 Journal article-refereed

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