Failure mechanism of solder interconnections under thermal cycling conditions

Toni T. Mattila, Maik Mueller, Mervi Paulasto-Kröckel, Klaus-Juergen Wolter

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

16 Citations (Scopus)

Original language	English
Title of host publication	ESTC 3rd Electronic System-Integration Technology Conference, Berlin, Germany, September 13-16, 2010
Publisher	IEEE
Pages	1-8
ISBN (Electronic)	978-1-4244-8554-3
ISBN (Print)	978-1-4244-8553-6
Publication status	Published - 2010
MoE publication type	A4 Conference publication

Cite this

@inproceedings{d8a19cbbd176416e82efb7a5ea4f40e7,

title = "Failure mechanism of solder interconnections under thermal cycling conditions",

author = "Mattila, {Toni T.} and Maik Mueller and Mervi Paulasto-Kr{\"o}ckel and Klaus-Juergen Wolter",

year = "2010",

language = "English",

isbn = "978-1-4244-8553-6",

pages = "1--8",

booktitle = "ESTC 3rd Electronic System-Integration Technology Conference, Berlin, Germany, September 13-16, 2010",

publisher = "IEEE",

address = "United States",

}

Failure mechanism of solder interconnections under thermal cycling conditions. / Mattila, Toni T.; Mueller, Maik; Paulasto-Kröckel, Mervi et al.
ESTC 3rd Electronic System-Integration Technology Conference, Berlin, Germany, September 13-16, 2010. IEEE, 2010. p. 1-8.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Failure mechanism of solder interconnections under thermal cycling conditions

AU - Mattila, Toni T.

AU - Mueller, Maik

AU - Paulasto-Kröckel, Mervi

AU - Wolter, Klaus-Juergen

PY - 2010

Y1 - 2010

UR - http://dx.doi.org/10.1109/ESTC.2010.5642843

M3 - Conference article in proceedings

SN - 978-1-4244-8553-6

SP - 1

EP - 8

BT - ESTC 3rd Electronic System-Integration Technology Conference, Berlin, Germany, September 13-16, 2010

PB - IEEE

ER -