Evaluation of mechanical stresses in silicon substrates due to lead-tin solder bumps via synchrotron X-ray topography and finite element modeling

J. Kanatharana, J.J. Pérez-Camacho, T. Buckley, P.J. McNally, T. Tuomi, A.N. Danilewsky, M. "O'Hare", D. Lowney, W. Chen, R. Rantamäki, L. Knuuttila, J. Riikonen

    Research output: Contribution to journalArticleScientificpeer-review

    13 Citations (Scopus)
    Original languageEnglish
    Pages (from-to)209-221
    JournalMicroelectronic Engineering
    Issue number65
    Publication statusPublished - 2003
    MoE publication typeA1 Journal article-refereed

    Keywords

    • lead-tin soldr bumps
    • silicon
    • synchrotron w-ray topography

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