Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate

Tuomas F. Waris*, Markus P.K Turunen, Tomi Laurila, Jorma K. Kivilahti

*Corresponding author for this work

    Research output: Contribution to journalArticleScientificpeer-review

    4 Citations (Scopus)

    Abstract

    Integral nickel-phosphorus (NiP) resistors were fabricated on flexible polyimide (PI) substrates by electroless NiP deposition. The deposition process was first set up for standard rigid epoxy substrates and then modified for the flexible substrates. The effects of the PI surface modifications on the interfacial adhesion (NiP/PI) were measured experimentally by the pull-off method. The process parameters were optimised to give good adhesion. The mechanical durability of the electrolessly deposited thin film NiP resistors was tested by measuring the electrical resistance during cyclic loading. The results showed the resistors to be mechanically stable. The electrical resistance was also monitored continuously during exposure to corrosive gas environment. The corrosive environment had no significant effect on the resistance of either the electrolessly deposited resistors or the commercial integral resistors used as a reference. The results show that resistors can be fabricated on flexible PI substrate by the described method.

    Original languageEnglish
    Pages (from-to)665-673
    Number of pages9
    JournalMicroelectronics Reliability
    Volume45
    Issue number3-4
    DOIs
    Publication statusPublished - Mar 2005
    MoE publication typeA1 Journal article-refereed

    Keywords

    • adhesion
    • flexible
    • nickel
    • printed circuit board

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