Evaluation of electroless copper interconnect induced strain in Si IC processing using white beam synchrotron x-ray topography, micro-Raman spectroscopy and finite element modelling

J. Kanatharana; P.J. McNally; Turkka Tuomi; B.H.W. Toh; D. McNeill; W.M. Chen; J. Riikonen; L. Knuuttila; J.J. Pérez-Camacho

Evaluation of electroless copper interconnect induced strain in Si IC processing using white beam synchrotron x-ray topography, micro-Raman spectroscopy and finite element modelling

J. Kanatharana
, P.J. McNally
, Turkka Tuomi
, B.H.W. Toh
, D. McNeill
, W.M. Chen
, J. Riikonen
, L. Knuuttila
, J.J. Pérez-Camacho

Research output: Working paper › Professional

Original language	English
Place of Publication	Hampuri
Pages	253-254
Publication status	Published - 2003
MoE publication type	D4 Published development or research report or study

Publication series

Name	HASYLAB-DESY Annual Report 2002, Part I

Keywords

copper intercomects
finite element modelling
Raman spectrometry
strain
synchrotron x-ray topography

Cite this

Kanatharana, J., McNally, P. J., Tuomi, T., Toh, B. H. W., McNeill, D., Chen, W. M., Riikonen, J., Knuuttila, L., & Pérez-Camacho, J. J. (2003). Evaluation of electroless copper interconnect induced strain in Si IC processing using white beam synchrotron x-ray topography, micro-Raman spectroscopy and finite element modelling. (pp. 253-254). (HASYLAB-DESY Annual Report 2002, Part I).

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author = "J. Kanatharana and P.J. McNally and Turkka Tuomi and B.H.W. Toh and D. McNeill and W.M. Chen and J. Riikonen and L. Knuuttila and J.J. P{\'e}rez-Camacho",

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AU - Kanatharana, J.

AU - McNally, P.J.

AU - Tuomi, Turkka

AU - Toh, B.H.W.

AU - McNeill, D.

AU - Chen, W.M.

AU - Riikonen, J.

AU - Knuuttila, L.

AU - Pérez-Camacho, J.J.

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KW - finite element modelling

KW - Raman spectrometry

KW - strain

KW - synchrotron x-ray topography

KW - copper intercomects

KW - finite element modelling

KW - Raman spectrometry

KW - strain

KW - synchrotron x-ray topography

M3 - Working paper

T3 - HASYLAB-DESY Annual Report 2002, Part I

SP - 253

EP - 254

BT - Evaluation of electroless copper interconnect induced strain in Si IC processing using white beam synchrotron x-ray topography, micro-Raman spectroscopy and finite element modelling

CY - Hampuri

ER -