Evaluation of electroless copper interconnect induced strain in Si IC processing using white beam synchrotron x-ray topography, micro-Raman spectroscopy and finite element modelling

J. Kanatharana, P.J. McNally, Turkka Tuomi, B.H.W. Toh, D. McNeill, W.M. Chen, J. Riikonen, L. Knuuttila, J.J. Pérez-Camacho

    Research output: Working paperProfessional

    Original languageEnglish
    Place of PublicationHampuri
    Pages253-254
    Publication statusPublished - 2003
    MoE publication typeD4 Published development or research report or study

    Publication series

    NameHASYLAB-DESY Annual Report 2002, Part I

    Keywords

    • copper intercomects
    • finite element modelling
    • Raman spectrometry
    • strain
    • synchrotron x-ray topography

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