Evaluation of Bismuth as a Filler Material for Anisotropically Conductive Adhesive

M. Vuorela, J.K. Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference contributionScientificpeer-review

    Original languageEnglish
    Title of host publicationPolytronic 2001, Potsdam, Germany, 21.-24.10.2001
    Place of PublicationSaksa, Potsdam
    PublisherIEEE and VDI/VDE-IT
    Pages202
    Publication statusPublished - 2001
    MoE publication typeA4 Article in a conference publication

    Keywords

    • adhesive
    • bismuth
    • filler material

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