Etching through silicon wafer in inductively coupled plasma

S. Franssila; J. Kiihamäki; J. Karttunen

Etching through silicon wafer in inductively coupled plasma

S. Franssila, J. Kiihamäki, J. Karttunen

School of Electrical Engineering

Research output: Contribution to journal › Article › Scientific › peer-review

24 Citations (Scopus)

Original language	English
Pages (from-to)	141-144
Journal	Microsystem Technologies
Volume	6
Publication status	Published - 2000
MoE publication type	A1 Journal article-refereed

Keywords

etch stop
footing
ICP
MEMS
notching
silicon

Cite this

@article{3bde207a669549e7b5ce9473af733b83,

title = "Etching through silicon wafer in inductively coupled plasma",

keywords = "etch stop, footing, ICP, MEMS, notching, silicon, etch stop, footing, ICP, MEMS, notching, silicon, etch stop, footing, ICP, MEMS, notching, silicon",

author = "S. Franssila and J. Kiiham{\"a}ki and J. Karttunen",

year = "2000",

language = "English",

volume = "6",

pages = "141--144",

journal = "Microsystem Technologies",

issn = "1432-1858",

publisher = "Springer",

}

TY - JOUR

T1 - Etching through silicon wafer in inductively coupled plasma

AU - Franssila, S.

AU - Kiihamäki, J.

AU - Karttunen, J.

PY - 2000

Y1 - 2000

KW - etch stop

KW - footing

KW - ICP

KW - MEMS

KW - notching

KW - silicon

KW - etch stop

KW - footing

KW - ICP

KW - MEMS

KW - notching

KW - silicon

KW - etch stop

KW - footing

KW - ICP

KW - MEMS

KW - notching

KW - silicon

UR - https://www.scopus.com/pages/publications/0006790133

M3 - Article

SN - 1432-1858

VL - 6

SP - 141

EP - 144

JO - Microsystem Technologies

JF - Microsystem Technologies

ER -

Etching through silicon wafer in inductively coupled plasma

Keywords

Other files and links

Cite this