Electroless nickel plating process model for plated-through-hole board manufacturing

Research output: Contribution to journalArticleScientificpeer-review

Researchers

  • R. Tenno
  • K. Kantola
  • A. Tenno

Research units

Details

Original languageEnglish
Pages (from-to)1825-1836
JournalJournal of Electronic Materials
Volume35
Issue number10
Publication statusPublished - 2006
MoE publication typeA1 Journal article-refereed

    Research areas

  • electroless plating, modeling, nickel, state estimation

ID: 3418192